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SKU: 39729 Category:

Syringe 10CC RL-403 High quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb67 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding

1.Good adhesion. Paste delicate, particles small, only 20~38 microns.
2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.
3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive

Additional information

Weight0.05 g
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