In stock

SKU: 69573 Category:

Relife RL-400 RL-401 RL-402  No-clean 183°C Soldering Paste for Phones BGA Reballing Soldering

  • 183°C Solder paste with high quality
  • Solder wicking is strong
  • Less residual
  • No-clean
  • Alloy Ratio: Sn63/Pb37
  • Viscosity: 160 ~ 230Pa.s
  • The size of granule: 20-38um

Package includes:
1 x Soldering Paste

Additional information

Weight0.05 g
Be the first to review “RELIFE RL-400 RL-401 RL-402 NO-CLEAN 183°C SOLDERING PASTE”

Your email address will not be published. Required fields are marked *


There are no reviews yet.

Vendor Information

  • No ratings found yet!

Main Menu